LFSOLDER TLF-49 SERIES
The series was developed with a view to reduce lead (Pb) from the solder paste used for the soldering of electronic equipment. A variety of alloy compositions mainly of Sn-Ag-Cu and Sn-Ag-Cu-Bi have been lined up at present for your examination.
LFSOLDER LF-101-15
LFSOLDER LF-204-15
The series was developed aiming at the reduction of lead (Pb) from the solder paste used for packages. The solder paste enabled for the first time in the industry to print in 100ƒÊm pitch. Consider the items by all means.
DSR-2200BGX-700J-15
Very excellent in HAST resistance and in PCT resistance as photo-developing type liquid-state solder resist for BGA and CSP, it was developed to realize high reliability. Consider the use of the item by all means.
RMA-10-29N
It is a solder paste special designed for fine pitch without washing. It is excellent in 0.3mm pitch resolution and stability in continuous printing.
