• “Matte” side releasable! No out-gassing or contaminant transfer that will affect solder adhesion
• Engineered conformance layer that prevents uncontrolled “squeeze-out” and meets Mil and IPC Specs
• “Ultra smooth” surface finish for superior adhesive flow control
• Extremely low X-Y axis movement
• Clean, inert with no out-gassing of contaminants or solvents harmful to vacuum systems
• Operating temperature to 425°F (218°C) with reduced ram pressures
• Environmentally friendly with no ozone-depleting chemicals or flourines. Suitable for incinerator or landfill disposal!