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  • Easy release at temperatures up to 500°F / 260°C
  • Excellent flexibility
  • Low X-Y axis shrinkage
  • Ultra smooth surface finish, with superior conformal properties
  • Inert and homogenous
  • No separator plate residue, prepreg or vacuum system contamination
  • Available in 2 Mils thickness .002” or 50.8 microns

An ultra high performance Release Films with grades that withstand operating temperatures up to 500°F/260°C. PACOLON™ films are engineered to provide excellent, contamination-free release during the process of laminating Rigid Polyimide PCBs, all Flexible Circuit Boards, Teflon and other demanding applications.

For more info, please directly contact

Ivan Lau