Hover
An ultra high performance Release Films with grades that withstand operating temperatures up to 500°F/260°C. PACOLON™ films are engineered to provide excellent, contamination-free release during the process of laminating Rigid Polyimide PCBs, all Flexible Circuit Boards, Teflon and other demanding applications.
For more info, please directly contact:
Mr Ivan Lau
Email: lau.ivan@ese.com.sg
Phone: (65) 68622288 ext 111
• Easy release at temperatures up to 500°F / 260°C
• Excellent flexibility
• Low X-Y axis shrinkage
• Ultra smooth surface finish, with superior conformal properties
• Inert and homogenous
• No separator plate residue, prepreg or vacuum system contamination
• Available in 2 Mils thickness .002” or 50.8 microns
