PACOLON

Description

Easy release at temperatures up to 500°F / 260°C
Excellent flexibility
Low X-Y axis shrinkage
Ultra smooth surface finish, with superior conformal properties
Inert and homogenous
No separator plate residue, prepreg or vacuum system contamination
Available in 2 Mils thickness .002” or 50.8 microns

An ultra high performance Release Films with grades that withstand operating temperatures up to 500°F/260°C. PACOLON™ films are engineered to provide excellent, contamination-free release during the process of laminating Rigid Polyimide PCBs, all Flexible Circuit Boards, Teflon and other demanding applications.