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  •  Contaminate free release from High Temperature Laminates and Separator Plates
  •  Rated for Operating Temperatures up to 650°F (343°C) for up to 2 Hours
  •  Optimal thickness at 1.5 mils (38μm) for easy Handling
  •  No embedded impurities
  •  Extremely low X&Y Axis shrinkage
  •  Minimal static potential
  •  Essentially inert: no out-gassing, no plate residue, no inter-laminar adhesion influence, and no vacuum system   contamination

A two-sided Release Film engineered for Ultra High Temperature PCB laminations requiring an easy clean release after elevated temperature lamination cycles.

For more info, please directly contact

Ivan Lau