PACOVIA #3000

Description

Two engineered Grades to fit all sequential lamination demands
Choice of PACOPADS™ Pressure Equalizing Press Pads designed to suit all lamination process parameters
Operating temperature of 425°F / 218°C for up to 4 hours
Essentially inert, no out-gassing, plate residue, interlaminate adhesion influence, no vacuum system contamination
Environmentally friendly: no chrome-depleting chemicals, no Fluorine’s
The PACO•VIA™ 3000 System is designed to contain the resin flow within Blind Via Holes (onto adjacent copper-carrying layers) and to fill buried Via Barrels, under a wide range of Lamination Pressures (175-350 psi/12-24 kg/ cm2), Hole Diameters (.004 to .040”/0.1 to 1.0mm), Heat Rises and Prepreg types
The PACO•VIA™ 3000 System performs effectively well in Hydraulic and Hydraulic Vacuum-assist as well as with both stainless steel and aluminum Separator Plates. Steel is preferred
The PACO•VIA™ 3000 System is suitable for all resin system types when laminated within the listed temperature constraints

A two-sided release film designed to be part of a Two-Component System (PACO•VIA™ 3000 and PACOPADS™) as a performance-driven line of High-Temperature, Resin-Blocking Release Films. The PACO•VIA™ 3000 System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards.