• Home
  • About Us
    • Company
    • ESE Network
  • Products
    • Smartcard
    • Printing
    • Mechanical Process
  • Career
  • Contact
  • 53 Serangoon North Ave 4 #03-02/03 Singapore 555852
  • enquiry@ese.com.sg
  • (65) 6862-2288
  • Home
  • About Us
    • Company
    • ESE Network
  • Products

      Browse By Industry

      Smartcard
      Printing
      Mechanical Process

      Browse By BRAND

      AD Doctorblade
      ENCOAT
      Pacothane
      Pneumatrol
      Procard Group

       

      Rogers
      S-Torq
      Toyobo
      Shako
      sm2
      shutterstock_158543681
      hi
  • Career
  • Contact
  • Home
  • About Us
    • Company
    • ESE Network
  • Products

      Browse By Industry

      Smartcard
      Printing
      Mechanical Process

      Browse By BRAND

      AD Doctorblade
      ENCOAT
      Pacothane
      Pneumatrol
      Procard Group

       

      Rogers
      S-Torq
      Toyobo
      Shako
      sm2
      shutterstock_158543681
      hi
  • Career
  • Contact

PACOVIA #3000

 Back to shop
pacovia3000 zoom

Hover

pacovia3000
Full Screen

PACOVIA #3000

A two-sided release film designed to be part of a Two-Component System (PACO•VIA™ 3000 and PACOPADS™) as a performance-driven line of High-Temperature, Resin-Blocking Release Films. The PACO•VIA™ 3000 System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards.

For more info, please directly contact:
Mr Ivan Lau
Email: lau.ivan@ese.com.sg
Phone: (65) 68622288 ext 111

Request For Quote

Categories: Pacothane, Release Products, Smartcard
  • Description

Description

• Two engineered Grades to fit all sequential lamination demands
• Choice of PACOPADS™ Pressure Equalizing Press Pads designed to suit all lamination process parameters
• Operating temperature of 425°F / 218°C for up to 4 hours
• Essentially inert, no out-gassing, plate residue, interlaminate adhesion influence, no vacuum system contamination
• Environmentally friendly: no chrome-depleting chemicals, no Fluorine’s
• The PACO•VIA™ 3000 System is designed to contain the resin flow within Blind Via Holes (onto adjacent copper-carrying layers) and to fill buried Via Barrels, under a wide range of Lamination Pressures (175-350 psi/12-24 kg/ cm2), Hole Diameters (.004 to .040”/0.1 to 1.0mm), Heat Rises and Prepreg types
• The PACO•VIA™ 3000 System performs effectively well in Hydraulic and Hydraulic Vacuum-assist as well as with both stainless steel and aluminum Separator Plates. Steel is preferred
• The PACO•VIA™ 3000 System is suitable for all resin system types when laminated within the listed temperature constraints

 

 PACOVIA #3000

Related products

  • ARLON® Self-Fusing Silicone Tapes

    Read more
  • PACOTHERM # TRIPAK

    Read more
  • THERMOFILM

    Read more


© Copyright 2021 ESE Industries (S) Pte Ltd. All Rights Reserved.
  • Privacy Policy
  • Contact