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  •  Contaminate free release from resins and separator plates
  •  Rated for Operating Temperatures up to 400°F (204°C) for up to 2 Hours
  •  Optimal thickness at 1.5 mils (38μm) for easy Handling (50% thicker than competitive release films)
  •  No embedded impurities
  •  Extremely low X&Y Axis shrinkage with reduced static potential
  •  Essentially inert: no out-gassing, no plate residue, no inter-laminar adhesion influence, and no vacuum system contamination
  •  Environmentally friendly: no Ozone depleting chemicals, no fluorine’s

A High Temperature resistant release film specifically engineered for laminating rigid, flexible and specialty substrate Printed Circuit Boards.

For more info, please directly contact

Ivan Lau